Both TSMC and Samsung have put into mass production of 5nm process. The former's OEM products include Apple A14, M1, Huawei Kirin 9000, etc., while the latter include Exynos 1080, Mydragon 888, etc.TSMC and Samsung have actually introduced EUV lithography since 7nm, but with fewer layers of process.According to ASML, EUV has 10 to 14 layers after iteration to 5nm, including but not limited to contact, through-hole and key metal layer processes.In the future, 3nm and 2nm will be even more dependent on EUV.
According to the latest data, ASML completed the shipment of its 100th EUV lithography machine in mid-December.The good news is that ASML is expected to have 45 to 50 EUV lithography units in capacity this year (2021).
After all, ASML shipped only 26 units in 2019, and a total of 23 units (an estimated 35 units for the whole year) since the third quarter of last year.
In addition, ASML is scheduled to deliver the latest generation EUV Photoengraving machine TWINSCAN NXE:3600D in the middle of next year, with an 18% increase in production efficiency and an improved accuracy of 1.1nm for the machine. The price per unit may be higher than the 120 million euro (about RMB 9.5 million yuan) of the old model.